Study on the contact resistance of various metals (Au, Ti, and Sb) on Bi–Te and Sb–Te thermoelectric films-Reference-Cited by-同舟云学术

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Study on the contact resistance of various metals (Au, Ti, and Sb) on Bi–Te and Sb–Te thermoelectric films

Published:2016-05-26 Issue:6S3 Volume:55 Page:06JE03
ISSN:0021-4922
Container-title:Japanese Journal of Applied Physics
language:
Short-container-title:Jpn. J. Appl. Phys.

Author:

Yong Ho,Na Sekwon,Gang Jun-Gu,Shin HaeSun,Jeon Seong-Jae,Hyun SeungMin,Lee Hoo-Jeong

Publisher

IOP Publishing

Subject

General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering

Link

http://stacks.iop.org/1347-4065/55/i=6S3/a=06JE03/pdf

Reference31 articles.

1. Thermoelectrics

2. Thin-film thermoelectric devices with high room-temperature figures of merit

3. On-chip cooling by superlattice-based thin-film thermoelectrics

4. Thermoelectric microdevice fabricated by a MEMS-like electrochemical process

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1. Low Contact Resistivity of Bi₂Te₃‐Based Films and Metals Interfaces Enabled by Orientation Regulation;Advanced Materials Interfaces;2024-04-04

2. Metallization and Diffusion Bonding of CoSb3-Based Thermoelectric Materials;Materials;2020-03-03

3. Recent development and application of thin-film thermoelectric cooler;Frontiers of Chemical Science and Engineering;2019-07-16

4. Amorphous InGaZnO and metal oxide semiconductor devices: an overview and current status;Journal of Materials Chemistry C;2019

5. High-Power-Density Skutterudite-Based Thermoelectric Modules with Ultralow Contact Resistivity Using Fe–Ni Metallization Layers;ACS Applied Energy Materials;2018-03-19

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