Interdiffusion Mechanism and Thermal Conductance at the Interfaces in Low-Temperature Cu-to-Cu Bonds Achieved by Coating Nanolayers-Reference-Cited by-同舟云学术

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Interdiffusion Mechanism and Thermal Conductance at the Interfaces in Low-Temperature Cu-to-Cu Bonds Achieved by Coating Nanolayers

Published:2023 Issue: Volume: Page:
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Author:

Jiang Xiaofan,Tao Zeming,Li Yuan,Sun Fangyuan,Yu Daquan,Zhong Yi

Publisher

Elsevier BV

Reference34 articles.

1. A Critical Review of Thermal Boundary Conductance across Wide and Ultrawide Bandgap Semiconductor Interfaces;T Feng;J. ACS Appl. Mater. Inter,2023

2. Thermal management and packaging of wide and ultra-wide bandgap power devices: a review and perspective;Y Qin;J. Phys. D: Appl. Phys,2023

3. Properties for Thermally Conductive Interfaces with Wide Band Gap Materials;S Khan;J. ACS Appl. Mater. Inter,2022

4. Power Electronic Modules

5. Perspective on thermal conductance across heterogeneously integrated interfaces for wide and ultrawide bandgap electronics;Z Cheng;J. Appl. Phys. Lett,2022

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