Effect of Film Formed by 2-Aminobenzimidazole and Ammonium Molybdate on Oxidation Resistance of Sn3.0ag0.5cu Solder Balls
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Publisher
Elsevier BV
Reference8 articles.
1. Effective Solder for Improved Thermo-Mechanic al Reliability of Solder Joints in a Ball Grid Array (BGA) Soldered on Printed Circui t Board (PCB);J A Depiver;J. Electron. Mater,2021
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3. A Study on the Thermal Oxidation and Wettability of Lead-free Solders of Sn-Ag-Cu and Sn-Ag-Cu-In;H Lee;Appl. sci. convergence technol,2014
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