Relationship between bonding strength and surface roughness in low-temperature bonding of glass for micro/nanofluidic device

Author:

Ohta RyoichiORCID,Morikawa KyojiroORCID,Tsuyama YoshiyukiORCID,Kitamori TakehikoORCID

Abstract

Abstract The bonding of glass substrates is an important process in the fabrication of glass micro/nanofluidic devices. In this study, the influence of the surface roughness of glass substrates after low-temperature bonding is investigated. It is found that plasma etching can be used to control the surface roughness to the range 2–9 nm. Substrates with a roughness of 5 nm or less can be bonded. The pressure capacity of devices tends to decrease with increasing surface roughness. A pressure capacity of 500 kPa or higher is obtained with a surface roughness of 2 nm or less. This criterion for bonding conditions can be applied to roughness formed by other methods (e.g. via a Cr layer). The proposed approach will facilitate the design and fabrication of glass micro/nanofluidic devices, especially those that complicated fabrication processes or embedding of multiple materials.

Funder

Japan Society for the Promotion of Science

Hsinchu Science Park Bureau, Ministry of Science and Technology, Taiwan

Publisher

IOP Publishing

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Mechanics of Materials,Electronic, Optical and Magnetic Materials

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