Electromigration in transition metals. II. Light interstitials in Cu, Ag, Ni, Pd, Al, V, Nb and Ta-Reference-Cited by-同舟云学术

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Electromigration in transition metals. II. Light interstitials in Cu, Ag, Ni, Pd, Al, V, Nb and Ta

Published:1991-09-23 Issue:38 Volume:3 Page:7331-7361
ISSN:0953-8984
Container-title:Journal of Physics: Condensed Matter
language:
Short-container-title:J. Phys.: Condens. Matter

Author:

Ek J van,Lodder A

Publisher

IOP Publishing

Subject

Condensed Matter Physics,General Materials Science

Reference72 articles.

1. Hydrogen as a Local Probe of Alloys: Nb 1- y V y

2. Electromigration of hydrogen in vanadium, niobium and tantalum

3. Electromigration of hydrogen in alloys: Evidence of unscreened proton behavior

4. Théorie Phénoménologique De L'effet Soret

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1. Theoretical Understanding of Electromigration-Related Surface Diffusion and Current-Induced Force in Ag–Pd Systems;ACS Omega;2024-06-26

2. Martin Fleischmann. 29 March 1927—3 August 2012;Biographical Memoirs of Fellows of the Royal Society;2022-11-09

3. Relationship between 〈111〉-oriented Cu film and thin Ta–W–N barrier;Japanese Journal of Applied Physics;2020-05-15

4. Growth of 〈111〉-oriented Cu layer on thin TaWN films;Japanese Journal of Applied Physics;2017-06-29

5. Compliance current dominates evolution of NiSi2 defect size in Ni/dielectric/Si RRAM devices;Microelectronics Reliability;2016-06

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