High performance liquid metal thermal interface materials

Author:

Chen SenORCID,Deng Zhongshan,Liu JingORCID

Abstract

Abstract Conventional thermal interface materials (TIMs) as widely used in thermal management area is inherently limited by their relatively low thermal conductivity. From an alternative, the newly emerging liquid metal based thermal interface materials (LM-TIMs) open a rather promising way, which can pronouncedly improve the thermal contact resistance and offers tremendous opportunities for making powerful thermal management materials. The LM-TIMs thus prepared exhibits superior thermal conductivity over many conventional TIMs which guarantees its significant application prospect. And the nanoparticles mediated or tuned liquid metal further enable ever conductive LM-TIMs which suggests the ultimate goal of thermal management. In this review, a systematic interpretation on the basic features of LM-TIMs was presented. Representative exploration and progress on LM-TIMs were summarized. Typical approaches toward nanotechnology enhanced high performance LM-TIMs were illustrated. The perspect of this new generation thermal management material were outlined. Some involved challenges were raised. This work is expected to provide a guide line for future research in this field.

Funder

National Natural Science Foundation of China

Publisher

IOP Publishing

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Mechanics of Materials,General Materials Science,General Chemistry,Bioengineering

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