The Simulation Analysis of IGBT Module Based on COMSOL

Abstract

Abstract IGBT, as the core device of high-capacity power electronic equipment, its stability is directly relevant to the normal operation of the equipment. It would cause system failure and major security incidents if aging failure phenomenon occurs. A complex multi-physical field coupling process is involved in the aging failure of IGBT. Based on Comsol software, this paper conducts a series of simulations on IGBT module model SKM50GB12T4, and also improves the simulation of the solder layer voids by combining with related literature on materials science to provide a basis for subsequent research on IGBT.