Deposition of silicon dioxide films with an atmospheric-pressure plasma jet
Author:
Publisher
IOP Publishing
Subject
Condensed Matter Physics
Reference23 articles.
1. Plasma‐Enhanced Chemical Vapor Deposition of Silicon Dioxide Deposited at Low Temperatures
2. Characteristics of Silicon Dioxide Films on Patterned Substrates Prepared by Atmospheric‐Pressure Chemical Vapor Deposition Using Tetraethoxysilane and Ozone
3. Dielectric Constant of Silicon Dioxide Deposited by Atmospheric-Pressure Chemical Vapor Deposition Using Tetraethylorthosilicate and Ozone
4. Plasma‐Enhanced Chemical Vapor Deposition of Silicon Dioxide Films Using Tetraethoxysilane and Oxygen: Characterization and Properties of Films
5. TEOS-based PECVD of silicon dioxide for VLSI applications
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