Three-dimensional crystal defect imaging by STEM depth sectioning

Abstract

Abstract One of the major innovations awaiting in electron microscopy is full three-dimensional imaging at atomic resolution. Despite the success of aberration correction to deep sub-ångström lateral resolution, spatial resolution in depth is still far from atomic resolution. In scanning transmission electron microscopy (STEM), this poor depth resolution is due to the limitation of the illumination angle. To overcome this physical limitation, it is essential to implement a next-generation aberration corrector in STEM that can significantly improve the depth resolution. This review discusses the capability of depth sectioning for three-dimensional imaging combined with large-angle illumination STEM. Furthermore, the statistical analysis approach remarkably improves the depth resolution, making it possible to achieve three-dimensional atomic resolution imaging at oxide surfaces. We will also discuss the future prospects of three-dimensional imaging at atomic resolution by STEM depth sectioning.