Shape memory performance of PETG 4D printed parts under compression in cold, warm, and hot programming

Author:

Soleyman E,Rahmatabadi D,Soltanmohammadi K,Aberoumand M,Ghasemi I,Abrinia K,Baniassadi MORCID,Wang K,Baghani MORCID

Abstract

Abstract The main novelty of this paper is the use of poly-ethylene terephthalate glycol (PETG) as a new shape memory polymer with excellent shape memory effect (SME) and printability. In addition, for the first time, the effect of programming temperature on PETG 4D printed samples has been studied. The amorphous nature of the PETG necessitates that molecular entanglements function as net points, which makes the role of programming temperature critical. SME comprehensively was conducted under compression loading for three programming conditions as well as various pre-strains. Significant results were obtained that summarized the gross differences exhibiting that the hot, cold, and warm programmed samples had the highest shape fixity, shape recovery, and stress recovery, respectively. The recovery and fixity ratios fell and rose, respectively, as the programming temperature increased. This effect intensified in hot programmed samples as the applied strain (loading time) expanded. So, the recovery ratio dropped from 68% to 50% by raising the pre-strain from 20% to 80%. The maximum stress recovery was 16 MPa, suggesting the fantastic benefit of warm programming conditions in PETG 4D printed parts. The locking mechanism (recovery force storage) for cold and hot programming is quite different. The dominant mechanism in cold programming is increasing internal energy by potential energy level enhancement. Contrary to this, in hot programming, the entropy reduction applies to the majority of the molecular segments, playing this role. By cooling, the state of the material changes from rubbery to glassy, and with this phase change, the oriented conformation of the deformed polymer chains is maintained under deformation. The results of this research can be used for various applications that require high shape fixity, recovery, or stress recovery.

Publisher

IOP Publishing

Subject

Electrical and Electronic Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science,Atomic and Molecular Physics, and Optics,Civil and Structural Engineering,Signal Processing

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