Cu-Ag core–shell nanoparticles with enhanced oxidation stability for printed electronics-Reference-Cited by-同舟云学术

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Cu-Ag core–shell nanoparticles with enhanced oxidation stability for printed electronics

Published:2015-10-22 Issue:45 Volume:26 Page:455601
ISSN:0957-4484
Container-title:Nanotechnology
language:
Short-container-title:Nanotechnology

Author:

Lee Changsoo,Kim Na Rae,Koo Jahyun,Lee Yung Jong,Lee Hyuck Mo

Funder

National Research Foundation of Korea

NRF of Korea grant funder by the Korean Goverment (MSIP)

Publisher

IOP Publishing

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Mechanics of Materials,General Materials Science,General Chemistry,Bioengineering

Link

http://stacks.iop.org/0957-4484/26/i=45/a=455601/pdf

Reference52 articles.

1. Inkjet printing as a deposition and patterning tool for polymers and inorganic particles

2. Inkjet printing of conductive materials: a review

3. RFID Tag and RF Structures on a Paper Substrate Using Inkjet-Printing Technology

4. Transparent conductive grids via direct writing of silver nanoparticle inks

5. Current Collecting Grids for ITO-Free Solar Cells

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2. Structure and plastic deformation of metastable Ag–Cu metal-matrix composites produced by a bottom-up way from Cu@Ag core–shell powders;Journal of Materials Science;2024-08

3. Rapid curing of printed pattern by UV irradiation and enhanced electrical conductivity in the flexible pattern consisting of Cu@Ag particles by successive photonic sintering;Progress in Organic Coatings;2024-08

4. Electrodeposition of Copper-Silver Alloys from Aqueous Solutions: A Prospective Process for Miscellaneous Usages;Compounds;2024-07-08

5. Hydrogel composites based on chitosan and CuAuTiO2 photocatalysts for hydrogen production under simulated sunlight irradiation;International Journal of Biological Macromolecules;2024-07

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