Stencil design for mixed technology through‐hole/SMT placement and reflow-Reference-Cited by-同舟云学术

Stencil design for mixed technology through‐hole/SMT placement and reflow

Published:2000-12 Issue:3 Volume:12 Page:8-12
ISSN:0954-0911
Container-title:Soldering & Surface Mount Technology
language:en
Short-container-title:Soldering & Surface Mount Tech

Author:

Coleman William E.,Jean Denis,Bradbury‐Bennett Julie R.

Publisher

Emerald

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science,Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science

Reference2 articles.

1. Gervascio, T. (1994), “Developing the paste‐in‐hole process”, Proceedings of Surface Mount International, San Jose, CA, pp. 333‐5.

2. Manessia, D. Whitmore, M. Adriance, J.H. and Westby, G.R. (1999), “Evaluation study of proflow system for stencil printing of thick boards (0.125”) in the alternative assembly and reflow technology (AART) or pin‐in‐paste process”, Proceedings of the Technical Program NEPCON West, Anaheim, CA, pp. 416‐9.

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