Abstract
PurposeThe purpose of this study is to investigate the effects of high-temperature oxidation tests and gas thermal shock tests on IC10 simulated components with thermal barrier coatings under different temperatures and oxidation times.Design/methodology/approachIn the high-temperature oxidation test, specimens were oxidized at three different temperatures of 850, 980, and 1,100 °C for durations of 10, 20, 50, 100, 200, and 300 h, respectively. In the gas thermal shock test, specimens were pre-oxidized for 10, 20, 50, and 100 h, followed by a high-temperature gas thermal shock test at 1,100 °C.FindingsIn the high-temperature oxidation tests, with increasing oxidation time, the oxidation layer thickened, and the air-film holes diameter decreased. The microstructure of the bond coat transitioned from strip-like to block-like, and internal cracks transformed from numerous and short to larger and deeper. Below the bond coat, a noticeable disappearance layer of strengthening phase appeared, with increasing thickness. The strengthening phase in the substrate transitioned from regular square shapes to circles as temperature increased. In gas thermal shock tests at 1,100 °C, the oxidation weight gain ratio increased with longer pre-oxidation times, whereas the erosion weight loss ratio gradually decreased.Originality/valueThe originality and significance of this study lie in its departure from the typical subjects of high-temperature oxidation and thermal shock tests. Unlike common research targets, this study focuses on IC10 simulative specimens with thermal barrier coatings and air-film holes. Furthermore, it investigates the effects of varying temperatures and oxidation durations.