Mechanism for Adhesion of Epoxy Resin to Copper Substrate through C-H-Si Amorphous Thin Film
Author:
Affiliation:
1. Materials and Manufacturing Science, Graduate School of Engineering, Osaka University
2. Osaka University
Publisher
Sumart Processing Society for Minerals, Environment and Energy
Link
https://www.jstage.jst.go.jp/article/jspmee/10/5/10_308/_pdf
Reference17 articles.
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3. 川下隼介, 七藏司優斗, 池田徹, 小金丸正明, 外薗洋昭, 浅井竜 彦: “パワーモジュールにおける熱サイクル試験時の封止樹脂 のはく離予測評価”, スマートプロセス学会誌, 7-4, （2018）, 146- 153.
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5. W. Xie and S. K. Sitaraman: “Investigation of Interfacial Delamination of a Copper-Epoxy Interface Under Monotonic and Cyclic Loading: Modeling and Evaluation”, IEEE Transactions on advanced packaging, 26-4, （2003）, 441-446.
Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. High Adhesion of Hot-Dip Galvanized Steel and Silicone Adhesive through Si Amorphous Film;Journal of The Japan Institute of Electronics Packaging;2024-09-01
2. Improvement in Copper-Resin Bond Strength after High-Temperature Testing Using C–H–Si Thin Film;MATERIALS TRANSACTIONS;2022-06-01
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