1. Callister WD (2007) Materials science and engineering: an introduction, 7th edn. Wiley, New York
2. Gattie DK, Kellam NN, Schramski JR, Walther J (2011) Engineering education as a complex system. Eur J Eng Educ 36:521–535
3. Gui J, Li X, Wang J, Li W, Qin H (2021) Size effect on tensile performance of microscale Cu/Sn3.0Ag0.5Cu/Cu joints at low temperatures. J Mater Sci Mater Electron 32(24):28454–28467. https://doi.org/10.1007/s10854-021-07226-1
4. Gui J (2022) Mechanical performance and fracture behavior of lead-free microscale solder joints at low temperatures at their size effects. Master thesis. Guilin University of Electronic Technology, Guilin
5. Inoue I, Rodgers P, Tenant A, Spencer N (2015) Creative reductionism: how decreasing levels of information can stimulate designers imagination. In: E&PDE15, 17th international conference on engineering and product design education. The Design Society