Departure from Natural Convection (DNC) in Low-Temperature Boiling Heat Transfer Encountered in Cooling Microelectronic LSI Devices-Reference-Cited by-同舟云学术

Departure from Natural Convection (DNC) in Low-Temperature Boiling Heat Transfer Encountered in Cooling Microelectronic LSI Devices

Published:1988-06 Issue:3 Volume:9 Page:93-100
ISSN:0145-7632
Container-title:Heat Transfer Engineering
language:en
Short-container-title:Heat Transfer Engineering

Author:

OKTAY S.

Publisher

Informa UK Limited

Subject

Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics

Link

http://www.tandfonline.com/doi/pdf/10.1080/01457638808939675

Reference8 articles.

1. A Conduction-Cooled Module for High-Performance LSI Devices

2. Josephson Computer Technology: An IBM Research Project

3. The Evolution of Enhanced Surface Geometries for Nucleate Boiling

4. Bergles , A. E. , Collier , J. G. , Delhaye , J. M. , Hewitt , G. F. , and Mayinger , E. , Pool Boiling, inTwo-Phase Flow and Heat Transfer in the Power and Process Industries, Hemisphere Publishing Corporation , Washington , DC , 1981 , pp. 190 – 220 .

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