Novel nanostructured thermal interface materials: a review-Reference-Cited by-同舟云学术

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Novel nanostructured thermal interface materials: a review

Published:2017-04-19 Issue:1 Volume:63 Page:22-45
ISSN:0950-6608
Container-title:International Materials Reviews
language:en
Short-container-title:International Materials Reviews

Author:

Hansson Josef¹,Nilsson Torbjörn M. J.¹^ORCID,Ye Lilei²,Liu Johan¹³

Affiliation:

1. Electronics Materials and Systems Laboratory, Chalmers University of Technology, Gothenburg, Sweden

2. SHT Smart High Tech AB, Gothenburg, Sweden

3. SMIT Center, School of Mechanical Engineering and Automation, Shanghai University, Shanghai, People's Republic of China

Publisher

Informa UK Limited

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Link

https://www.tandfonline.com/doi/pdf/10.1080/09506608.2017.1301014

Reference175 articles.

1. Emerging challenges and materials for thermal management of electronics

2. Kapitza Resistance

3. Reliability of thermal interface materials: A review

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