Microstructure and properties of ultrasonic-assisted gallium-based alloys for room-temperature bonding of Cu/Cu-Reference-Cited by-同舟云学术

Microstructure and properties of ultrasonic-assisted gallium-based alloys for room-temperature bonding of Cu/Cu

Published:2023-07-07 Issue:1 Volume:103 Page:
ISSN:0950-0839
Container-title:Philosophical Magazine Letters
language:en
Short-container-title:Philosophical Magazine Letters

Author:

Yingying Qu¹,Qiuyue Fang¹,Liang Zhao²,Zuoxing Guo²

Affiliation:

1. School of Materials Science and Engineering, Jilin University, Changchun, People’s Republic of China

2. Key Laboratory of Automobile Materials, Ministry of Education & School of Materials Science and Engineering, Jilin University, Changchun, People’s Republic of China

Publisher

Informa UK Limited

Subject

Condensed Matter Physics

Link

https://www.tandfonline.com/doi/pdf/10.1080/09500839.2023.2230955

Reference22 articles.

1. Ultrasonic welding of fiber-reinforced thermoplastic composites: a review

2. On the metallurgical joining mechanism during ultrasonic spot welding of NiTi using a Cu interlayer

3. Three-dimensional hysteresis compensation enhances accuracy of robotic artificial muscles

4. Microstructural characterization and mechanical behavior of NiTi shape memory alloys ultrasonic joints using Cu interlayer;Zhang W.;Material,2018

5. Cavitation at filler metal/substrate interface during ultrasonic-assisted soldering. Part I: Cavitation characteristics

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Microstructure and Properties of Magnesium Alloy Joints Bonded by Using Gallium with the Assistance of Ultrasound at Room Temperature;Materials;2023-10-31