Multiple fields generated by two dissimilar conductive punches on thermoelectric material-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Multiple fields generated by two dissimilar conductive punches on thermoelectric material

Published:2023-09-08 Issue:1 Volume:47 Page:59-79
ISSN:0149-5739
Container-title:Journal of Thermal Stresses
language:en
Short-container-title:Journal of Thermal Stresses

Author:

Zhang Yali¹,Zhou Yueting²,Yang Juan³,Ding Shenghu¹^ORCID

Affiliation:

1. School of Mathematics and Statistics, Ningxia University, Yinchuan, P.R. China

2. School of Aerospace Engineering and Applied Mechanics, Tongji University, Shanghai, P.R. China

3. School of Ethnic Preparatory Education, Ningxia University, Yinchuan, P.R. China

Publisher

Informa UK Limited

Subject

Condensed Matter Physics,General Materials Science

Link

https://www.tandfonline.com/doi/pdf/10.1080/01495739.2023.2246521

Reference34 articles.

1. A comprehensive analysis of delamination and thermoelectric performance of thermoelectric pn-junctions with temperature-dependent material properties

2. Modeling of an Integrated Thermoelectric Generation–Cooling System for Thermoelectric Cooler Waste Heat Recovery

3. Numerical simulation on a compact thermoelectric cooler for the optimized design

4. Improving the thermoelectric properties of SrTiO3-based ceramics with metallic inclusions

5. On fabrication of functionally graded thermoelectric materials by spark plasma sintering

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. The influences of the punch geometry on the contact behaviors of a finite-thickness strip with thermoelectric effects;Acta Mechanica;2024-04-08

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3