Optimization of Design Parameters for a Sandwich-Distribution Porous-Microchannel Heat Sink-Reference-Cited by-同舟云学术

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Optimization of Design Parameters for a Sandwich-Distribution Porous-Microchannel Heat Sink

Published:2014-05-09 Issue:3 Volume:66 Page:229-251
ISSN:1040-7782
Container-title:Numerical Heat Transfer, Part A: Applications
language:en
Short-container-title:Numerical Heat Transfer, Part A: Applications

Author:

Hung Tu-Chieh,Yan Wei-Mon

Funder

The financial support by the National Science Council, R. O. C., through the contract NSC 101-2221-E145-003, is highly appreciated.

Publisher

Informa UK Limited

Subject

Condensed Matter Physics,Numerical Analysis

Link

http://www.tandfonline.com/doi/pdf/10.1080/10407782.2013.872978

Reference31 articles.

1. Sintered porous heat sink for cooling of high-powered microprocessors for server applications

2. Numerical Study of Heat Transfer in a Rectangular Channel with Porous Covering Obstacles

3. Forced convection cooling enhancement by use of porous materials

4. Heat transfer in the thermal entrance region for flow through rectangular porous passages

5. Interstitial Heat Transfer Coefficient and Dispersion Conductivity in Compressed Metal Foam Heat Sinks

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