Numerical Predictions of the Flow and Thermal Performance of Water-Cooled Single-Layer and Double-Layer Wavy Microchannel Heat Sinks
Author:
Publisher
Informa UK Limited
Subject
Condensed Matter Physics,Numerical Analysis
Link
http://www.tandfonline.com/doi/pdf/10.1080/10407782.2013.730445
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1. Cooling a Microprocessor Chip
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