An efficient reliability-based design optimization study for PCM-based heat-sink used for cooling electronic devices-Reference-Cited by-同舟云学术

An efficient reliability-based design optimization study for PCM-based heat-sink used for cooling electronic devices

Published:2020-10-23 Issue: Volume: Page:1-13
ISSN:1537-6494
Container-title:Mechanics of Advanced Materials and Structures
language:en
Short-container-title:Mechanics of Advanced Materials and Structures

Author:

Debich Bessem¹²,El Hami Abdelkhalak¹,Yaich Ahmed¹³,Gafsi Wajih²,Walha Lassaad²,Haddar Mohamed²

Affiliation:

1. Laboratory of Mechanics of Normandy (LMN), Mechanical Engineering Department, National Institute of Applied Sciences of Rouen, Rouen, France

2. Laboratory of Mechanics, Modeling and Manufacturing (La2MP), Mechanical Engineering Department, National School of Engineers of Sfax, Sfax, Tunisia

3. Institut Clement Ader (ICA), Mechanical Engineering Department, Universite de Toulouse, CNRS/INSA/ISAE/Mines Albi/UPS, Toulouse, France

Publisher

Informa UK Limited

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science,General Mathematics,Civil and Structural Engineering

Link

https://www.tandfonline.com/doi/pdf/10.1080/15376494.2020.1836291

Reference44 articles.

1. Bayesian surrogates for integrating numerical, analytical, and experimental data: application to inverse heat transfer in wearable computers

2. Cooling of portable hand-held electronic devices using phase change materials in finned heat sinks

3. Application of phase change materials in thermal management of electronics

4. W.R. Humphries and E.I. Griggs, A design handbook for phase change thermal control and energy storage devices, NASA STI/recon technical report, U.S. Department of Energy, United States, no. 78, 1977.

5. Avionics Passive Cooling With Microencapsulated Phase Change Materials

Cited by 21 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Numerical simulation of thermal performance of heat sink augmented with phase change material PCM integrated with solid and aluminum metal foam fins;Heat Transfer;2024-06-27

2. Thermal management of honeycomb heat sink filled with phase change material for smart lighting applications;Numerical Heat Transfer, Part A: Applications;2024-02-13

3. Enriching IRA for nonlinear and low-probability failure problems: The active learning Kriging-based inverse reliability analyses;Mechanics of Advanced Materials and Structures;2023-12-27

4. Highly thermal conductive Boron Nitride/Polyrotaxane encapsulated PEG-based phase change materials;European Polymer Journal;2023-11

5. References;Reliability‐based Modeling of System Performance;2023-09-08