Void content and interfacial properties of composite laminates under different autoclave cure pressure-Reference-Cited by-同舟云学术

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Void content and interfacial properties of composite laminates under different autoclave cure pressure

Published:2016-09-28 Issue:5 Volume:24 Page:529-540
ISSN:0927-6440
Container-title:Composite Interfaces
language:en
Short-container-title:Composite Interfaces

Author:

Chang Tengfei,Zhan Lihua,Tan Wei,Li Shujian

Funder

National Key Basic Research Program of China

State Key Laboratory of High-performance Complex Manufacturing

Central South University

Publisher

Informa UK Limited

Subject

Surfaces, Coatings and Films,General Physics and Astronomy,Ceramics and Composites

Link

http://www.tandfonline.com/doi/pdf/10.1080/09276440.2016.1237113

Reference18 articles.

1. Effect of cure cycle heat transfer rates on the physical and mechanical properties of an epoxy matrix composite

2. Machining of Carbon Fiber Reinforced Plastics/Polymers: A Literature Review

3. A method for the direct measurement of the fibre bed compaction curve of composite prepregs

4. The effects of void contents on the long-term hygrothermal behaviors of glass/epoxy and GLARE laminates

5. A review of NDE methods for porosity measurement in fibre-reinforced polymer composites

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1. Effects of Curing Defects in Adhesive Layers on Carbon Fiber–Quartz Fiber Bonded Joint Performance;Polymers;2024-05-15

2. Exploring the impact of void content and hygrothermal aging on the performance of carbon/epoxy composite laminates: a comprehensive study;Iranian Polymer Journal;2024-03-20

3. Void stability process window and parametric optimization for filament‐wound composite riser;Polymer Composites;2024-01-23

4. Investigation of interlayer toughening of carbon fiber composites using non-woven polyamide veils under different curing pressures;Journal of Composite Materials;2024-01-22

5. Resin pressure monitoring method and variation in autoclave processing of polymer composite laminates using capillary sensors;Iranian Polymer Journal;2023-11-07

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