Reduced interlayer defects of diamond/copper composite doped with holmium (III) oxide-Reference-Cited by-同舟云学术

Reduced interlayer defects of diamond/copper composite doped with holmium (III) oxide

Published:2020-12-22 Issue:11 Volume:28 Page:1109-1119
ISSN:0927-6440
Container-title:Composite Interfaces
language:en
Short-container-title:Composite Interfaces

Author:

Zhang Xiao Yu¹^ORCID,Xu Min²,Yang Wen Yao¹,Cao Sheng Zhu²,Yang Yan Ju¹,Li Jie¹,Hao Xi Yuan¹

Affiliation:

1. Chongqing Engineering Research Center of New Energy Storage Devices and Applications, Chongqing University of Arts and Sciences, Chongqing, P. R. China

2. Key Laboratory for National Defense Science and Technology on Vacuum Technology and Physics, Lanzhou Institute of Physics, Lanzhou, P. R. China

Funder

Science and Technology Research Program of Chongqing Municipal Education Commission

Chongqing University of Arts and Sciences

National College Students Innovation and Entrepreneurship Training Program

Publisher

Informa UK Limited

Subject

Surfaces, Coatings and Films,General Physics and Astronomy,Ceramics and Composites

Link

https://www.tandfonline.com/doi/pdf/10.1080/09276440.2020.1863178

Reference36 articles.

1. Thermal properties of diamond/copper composite material

2. Challenges and opportunities for electric aircraft thermal management

3. Numerical investigation of the effect of interfacial thermal resistance upon the thermal conductivity of copper/diamond composites

4. Understanding the thermal conductivity of Diamond/Copper composites by first-principles calculations

5. Enhanced thermal conductivity in copper matrix composites reinforced with titanium-coated diamond particles

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