Electroless copper plating of dielectrics from environmentally friendly reducer-free electrolyte-Reference-Cited by-同舟云学术

Electroless copper plating of dielectrics from environmentally friendly reducer-free electrolyte

Published:2021-08-17 Issue:5 Volume:99 Page:238-245
ISSN:0020-2967
Container-title:Transactions of the IMF
language:en
Short-container-title:Transactions of the IMF

Author:

Georgieva M.¹²^ORCID,Girginov Ch.³^ORCID,Petrova M.²,Lazarova D.²,Dobreva E.¹,Kozhukharov S.⁴

Affiliation:

1. Department of Chemistry, Faculty of Electronic Engineering and Technologies, Technical University of Sofia, Sofia, Bulgaria

2. Department of Electrochemistry and Corrosion, Institute of Physical Chemistry, Bulgarian Academy of Sciences, Sofia, Bulgaria

3. Department of Physical Chemistry, Faculty of Chemical Technology, University of Chemical Technology and Metallurgy, Sofia, Bulgaria

4. LAMAR Laboratory, University of Chemical Technology and Metallurgy, Sofia, Bulgaria

Funder

National Science Fund

European Regional Development Fund

National Centre for Mechatronics and Clean Technologies

Publisher

Informa UK Limited

Subject

Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,Condensed Matter Physics

Link

https://www.tandfonline.com/doi/pdf/10.1080/00202967.2021.1957339

Reference39 articles.

1. G. O. Mallory and J. B. Hajdu: Electroless plating: fundamentals and applications, Reprint Edition. Cambridge University Press, Chapter 14, 1990, 377–399.

2. E. J. O’Sullivan: in ‘Electrochemical technology’, (eds. L. T. Romankiw, T. Osaka, Y. Yamasaki, C. Madore), 159; 2000, Electrochemical Society of Japan.

3. Electroless plating of nickel–phosphorous on surface-modified poly(ethylene terephthalate) films

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