The Influence of Sulphur on the Anodic Behaviour of Nickel in Plating Solutions-Reference-Cited by-同舟云学术

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The Influence of Sulphur on the Anodic Behaviour of Nickel in Plating Solutions

Published:1975-01 Issue:1 Volume:53 Page:145-152
ISSN:0020-2967
Container-title:Transactions of the IMF
language:en
Short-container-title:Transactions of the IMF

Author:

Fisher G. L.,Morris P. E.

Publisher

Informa UK Limited

Subject

Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,Condensed Matter Physics

Link

https://www.tandfonline.com/doi/pdf/10.1080/00202967.1975.11870354

Reference24 articles.

1. The Effect of Composition and Structure on the Electrochemical Reactivity of Nickel

2. Protection by Metallic Coatings

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Electrodeposition of Nickel;Modern Electroplating;2011-02-24

2. Effect of S on Passivation of Ni Plating;Journal of The Electrochemical Society;2004

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