Pre-treatment of dielectrics and technological process for deposition of chemical copper layers from copper solution with improved ecological impact-Reference-Cited by-同舟云学术

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Pre-treatment of dielectrics and technological process for deposition of chemical copper layers from copper solution with improved ecological impact

Published:2020-03-03 Issue:2 Volume:98 Page:81-87
ISSN:0020-2967
Container-title:Transactions of the IMF
language:en
Short-container-title:Transactions of the IMF

Author:

Georgieva M.¹²,Chakarova V.²,Petrova M.²,Lazarova D.²,Dobrev D.¹³

Affiliation:

1. Department of Chemistry, Faculty of Electronic Engineering and Technologies, Technical University of Sofia, Sofia, Bulgaria

2. Department of Electrochemistry and Corrosion, Institute of Physical Chemistry-BAS, Sofia, Bulgaria

3. Institute of Mathematics and Informatics, Bulgarian Academy of Sciences, Sofia, Bulgaria

Publisher

Informa UK Limited

Subject

Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,Condensed Matter Physics

Link

https://www.tandfonline.com/doi/pdf/10.1080/00202967.2020.1718941

Reference6 articles.

1. Direct Electroplating on Nonconductors

2. A Palladium Sulfide Catalyst for Electrolytic Plating

3. Initial propagation stage of direct copper plating on non-conducting substrates

4. Mechanism of Direct Copper Plating on Nonconducting Substrates

5. Process of direct copper plating on ABS plastics

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1. An Antimicrobial Copper–Plastic Composite Coating: Characterization and In Situ Study in a Hospital Environment;International Journal of Molecular Sciences;2024-04-18

2. Selection of a suitable environmentally friendly (non-toxic) etching solution in the electroless metallisation of ABS polymers;Transactions of the IMF;2023-07-25

3. Surface modification of ABS polymer by electroless deposition of thin nickel film from a solution without reducing agent;Transactions of the IMF;2023-03-31

4. Study of a system for creating a statistical model of the electroless plating of Cu-Ni-P alloys;Transactions of the IMF;2022-08-17

5. Electroless Deposition of Cu-Ni-P Alloy Coatings on a Dielectric Surface for Application in Electronic;2022 13th National Conference with International Participation (ELECTRONICA);2022-05-19

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