Science challenges and research opportunities for plasma applications in microelectronics

Author:

Graves David B.1ORCID,Labelle Catherine B.2ORCID,Kushner Mark J.3ORCID,Aydil Eray S.4ORCID,Donnelly Vincent M.5ORCID,Chang Jane P.6ORCID,Mayer Peter7,Overzet Lawrence8ORCID,Shannon Steven9ORCID,Rauf Shahid10ORCID,Ruzic David N.11ORCID

Affiliation:

1. Department of Chemical and Biological Engineering, Princeton University 1 , Princeton, New Jersey 08540

2. Intel Corporation 2 , 1600 Rio Rancho Blvd SE, Rio Rancho, New Mexico 87124

3. Department of Electrical Engineering and Computer Science, University of Michigan 3 , Ann Arbor, Michigan 48109-2122

4. Department of Chemical and Biomolecular Engineering, Tandon School of Engineering, New York University 4 , New York, New York 11201

5. William A. Brookshire Department of Chemical and Biomolecular Engineering, University of Houston 5 , Houston, Texas 77204

6. Department of Chemical and Biomolecular Engineering, University of California Los Angeles 6 , Los Angeles, California 90095

7. ASML 7 , 17075 Thornmint Court, San Diego, California 92127

8. Department of Electrical and Computer Engineering, The University of Texas at Dallas 8 , Richardson, Texas 75080

9. Department of Nuclear Engineering, North Carolina State University 9 , Raleigh, North Carolina 27695-7909

10. Applied Materials, Inc. 10 , 3333 Scott Blvd., Santa Clara, California 95054

11. Department of Nuclear, Plasma, and Radiological Engineering, Center for Plasma-Material Interactions, University of Illinois at Urbana-Champaign 11 , Urbana, Illinois 61801

Abstract

Low-temperature plasmas (LTPs) are essential to manufacturing devices in the semiconductor industry, from creating extreme ultraviolet photons used in the most advanced lithography to thin film etching, deposition, and surface modifications. It is estimated that 40%–45% of all process steps needed to manufacture semiconductor devices use LTPs in one form or another. LTPs have been an enabling technology in the multidecade progression of the shrinking of device dimensions, often referred to as Moore’s law. New challenges in circuit and device design, novel materials, and increasing demands to achieve environmentally benign processing technologies require advances in plasma technology beyond the current state-of-the-art. The Department of Energy Office of Science Fusion Energy Sciences held a workshop titled Plasma Science for Microelectronics Nanofabrication in August 2022 to discuss the plasma science challenges and technical barriers that need to be overcome to continue to develop the innovative plasma technologies required to support and advance the semiconductor industry. One of the key outcomes of the workshop was identifying a set of priority research opportunities (PROs) to focus attention on the most strategic plasma science challenges to address to benefit the semiconductor industry. For each PRO, scientific challenges and recommended strategies to address those challenges were identified. This article summarizes the PROs identified by the workshop participants.

Funder

National Science Foundation

Samsung Electronics

U.S. Department of Energy

Alstadt Lord Mark Chair

William F. Seyer Chair

Publisher

American Vacuum Society

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