Interconnect Quality and Reliability of 3D Packaging-Reference-Cited by-同舟云学术

Interconnect Quality and Reliability of 3D Packaging

Published:2020-11-24 Issue: Volume: Page:527-573
ISSN:1437-0387
Container-title:3D Microelectronic Packaging
language:
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Author:

Wang Yaodong,Liu Yingxia,Li Menglu,Tu K. N.,Xu Luhua

Publisher

Springer Singapore

Link

http://link.springer.com/content/pdf/10.1007/978-981-15-7090-2_17

Reference88 articles.

1. K.N. Tu, Reliability challenges in 3D IC packaging technology. Microelectron. Reliab. 51(3), 517–523 (2011)

2. Y. Wang, I.M. De Rosa, K.N. Tu, Size effect on ductile-to-brittle transition in Cu-solder-Cu micro-joints, in 2015 Proceedings of 65th Electronic Components and Technology Conference (2015), pp. 632–639

3. S.F. Choudhury, L. Ladani, Grain growth orientation and anisotropy in Cu6Sn5 intermetallic: nanoindentation and electron backscatter diffraction analysis. J. Electron. Mater. 43(4), 996–1004 (2014)

4. K. Sakuma, K. Sueoka, S. Kohara, K. Matsumoto, H. Noma, T. Aoki, Y. Oyama, H. Nishiwaki, P.S. Andry, C.K. Tsang, J.U. Knickerbocker, Y. Orii, IMC bonding for 3D interconnection, in 2010 Proceedings of 60th Electronic Components and Technology Conference (2010), pp. 864–871

5. J.F. Li, P. Agyakwa, C.M. Johnson, Interfacial reaction in Cu/Sn/Cu system during the transient liquid phase soldering process. Acta Mater. 59(3), 1198–1211 (2011)

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