A study on the EDM drilling of reaction-bonded silicon carbide using different electrode materials

Abstract

AbstractToday, there is a growing demand for efficient hole manufacturing technology in many industries such as aeronautics, automotive and nuclear, among others. Thus, the present study deals with the machining of through holes on SiSiC advanced ceramic by using Electrical Discharge Machining (EDM) drilling technology. Since recommendations related to the electrode characteristics and settings parameters are found to be scant for the industrial use of EDM drilling of SiSiC ceramics, this research work comes to cover this gap as it presents a complete study focused on the influence on different electrodes under rough and finish machining conditions. In particular, the influence of four electrodes materials (copper, copper-tungsten, graphite and copper infiltrated graphite) and three different electrode diameters ranging from 2 to 4 mm are investigated. In addition, the rotational speed of the electrode is also analysed. From the experimental results, both electrode material and machining regime, seem to be the most relevant factors of all. In the case of 2 mm diameter electrode, material removal rate (MRR) with Cu electrode was, approximately, 4.5 times higher than that obtained with a C electrode. In fact, it was found that copper electrode rotating at 20 rpm combined with high values of discharge energy (I = 2 A; ti = 70 µs) is the most economical option in terms of production cost and production time, as it gives a high MRR of 0.4754 mm3/min and a minimum electrode wear (EW) value of 7.52%. Moreover, slightly higher values of MRR were achieved for CuC electrode compared to those obtained with C electrode, indicating that the addition of Cu in the electrode contributes to a greater removal of material. However, a value of Ra of 0.37 µm could be obtained by setting low current intensity values (I = 0.5 A; ti = 45 µs) combined with C electrodes and with no rotation.