Warpage and residual stress analyses of post-mold cure process of IC packages

Abstract

Abstract To improve the production yield rate, reliability is one of the important indicators of electronic packaging products. In past research, however, the influence of the fabrication process was rarely taken into consideration. In this thesis, mold flow analysis software Moldex3D is used to develop a series analysis procedure for IC package products. The effects of many factors, including process, structure, and materials were being taken into account. Especially for epoxy molding compound, namely EMC, is studied on its properties during the molding and post-mold cure (PMC) processes. This paper adopted P–V-T-C equations, which consider both volume shrinkage due to thermal mismatch and chemical shrinkage to predict the amount of warpage and residual stresses after the mold filling process. Next, dual shift factor model for viscoelastic analysis was used to model the PMC process and predict the amount of warpage and residual stresses after PMC. And the influence of different PMC process conditions and loading conditions on the warpage results is discussed. The residual stresses after PMC simulation are set as the initial conditions for reliability analysis and then the stress distribution after two thermal cycles is analyzed. It is observed that the deformed shape of the simulation and experiment results after PMC were consistent. Both are concave downwards. In comparison with experiment results, the error of warpage simulation results was between 10% and 50%. The biggest error was found in the short direction. During two thermal cycles, it is can be found that the maximum stress of the lead frame is 505.7 MPa and the location of the possible failure is at the top left of the die. In addition, when considering or not considering the process-induced residual stress in the thermal cycle analysis, the stress states are very different.