Author:
Arif Muhammad,Rahman Mustafizur,San Wong Yoke
Publisher
Springer Science and Business Media LLC
Subject
Industrial and Manufacturing Engineering,Computer Science Applications,Mechanical Engineering,Software,Control and Systems Engineering
Reference103 articles.
1. Sreejith PS, Udupa G, Noor YBM, Ngoi BKA (2001) Recent advances in machining of silicon wafers for semiconductor applications. J Adv Manuf Technol 17:157–162
2. May GS, Sze SM (2004) Fundamentals of semiconductor fabrication. Wiley, New York, p 1
3. iSuppli, 2007 and 2008 semiconductor forecast adjustments. www.semiconductors.tekrati.com/research/9887/S/ . Accessed on: 5 Jan
4. Van Zant P (2000) Microchip fabrication. McGraw-Hill, New York, p 37
5. Pei ZJ, Fisher GR, Liu J (2008) Grinding of silicon wafers: a review from historical perspectives. Int J Mach Tool Manuf 48:1297–1307
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