Damage mechanisms during lapping and mechanical polishing CdZnTe wafers

Author:

Li Yan,Kang Renke,Gao Hang,Wu Dongjiang

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Metals and Alloys,Physical and Theoretical Chemistry,Condensed Matter Physics

Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Compound mechanical and chemical-mechanical polishing processing technique for single-crystal silicon carbide;Precision Engineering;2024-03

2. Machining Stability Research of Soft-Brittle Crystals Lapping by Fixed-Abrasive Pad;Integrated Ferroelectrics;2022-07-28

3. Impact of polishing on crystallinity and static performance of Cd1−xZnxTe;Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment;2020-12

4. Compliant grinding and polishing: A review;International Journal of Machine Tools and Manufacture;2020-11

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