Modeling and control of time-pressure dispensing for semiconductor manufacturing-Reference-Cited by-同舟云学术

Modeling and control of time-pressure dispensing for semiconductor manufacturing

Published:2007-10 Issue:4 Volume:4 Page:422-427
ISSN:1476-8186
Container-title:International Journal of Automation and Computing
language:en
Short-container-title:Int J Automat Comput

Author:

Chen Cong-Ping,Li Han-Xiong,Ding Han

Publisher

Springer Science and Business Media LLC

Subject

Applied Mathematics,Computer Science Applications,Modelling and Simulation,Control and Systems Engineering

Link

http://link.springer.com/content/pdf/10.1007/s11633-007-0422-8.pdf

Reference17 articles.

1. R. Bush. Matching Fluid Dispensers to Materials for Electronics Applications. Electronic Packaging & Production, vol. 37, no. 9, pp. 6–62, 1997.

2. A. Razban. Intelligent Control of an Automated Adhesive Dispensing Cell. Ph.D. dissertation, Imperial College, London, UK, 1993.

3. D. Dixon. Practical Issues Concerning Dispensing Pump Technologies. Circuits Assembly, vol. 8, no. 8, pp. 36–40, 1997.

4. Y. P. Hong, H. X. Li. Comparative Study of Fluid Dispensing Modeling. IEEE Transactions on Electronics Packaging Manufacturing, vol. 26, no. 4, pp. 273–280, 2003.

5. P. Kropp. Problems with High Speed Adhesive Dispensing. In Proceedings of 7th International SAMPE Electronics Conference, Parsippany NJ, USA, pp. 487–493, 1994.

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