Author:
Visser Robert Jan,Moro Lorenza,Chu Xi,Chen Jerry R.,van de Weijer Peter,Akkerman Hylke B.,Graham Samuel,Söderlund Mikko,Perrotta Alberto,Creatore Maria Adriana
Reference147 articles.
1. Abdulagatov AI, Yan Y, Cooper JR, Zhang Y, Gibbs ZM, Cavanagh AS, Yang RG, Lee YC, George SM (2012) Al2O3 and TiO2 atomic layer deposition on copper for water corrosion resistance. ACS Appl Mater Interfaces 3(12):4593–4601
2. Affinito JD, Gross ME, Coronado CA, Graff GL, Greenwell IN, Martin PM (1996) A new method for fabricating transparent barrier layers. Thin Solid Films 290:63–67
3. Aixtron SE. Herzogenrath, Germany (2018) (Proprietary) “PECVD to deposit flexible barrier films for thin-film encapsulation OPTACAP™” at
https://www.aixtron.com/en/products/technologies/
consulted on 4/17/2018
4. Akedo K, Miura A, Fujikawa H, Taga Y (2005) Plasma-CVD SiNx/plasma-polymerized CNx:H multi-layer passivation films for organic light-emitting diodes. R&D Rev Toyota CRDL 40:40–44
5. Alfonso E, Olaya J, Cubillos G (2012) Thin film growth through sputtering technique and its applications, crystallization – science and technology, Dr. Marcello Andreeta (ed) InTech. Available from thin film growth through sputtering technique and its applications | InTechOpen.
https://doi.org/10.5772/35844
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