Author:
Okoro Chukwudi,Levine Lyle E.,Xu Ruqing,Obeng Yaw
Funder
National Institute of Standards and Technology
U.S. Department of Energy (DOE), Office of Science
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Reference41 articles.
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2. International Technical Roadmap for Semiconductors (ITRS) (2013) Edition on interconnects,
http://www.itrs.net/links/2013ITRS/2013Chapters/2013Interconnect.pdf
3. Okoro C, Levine LE, Xu R, Hummler K, Obeng YS (2014) Synchrotron-based measurement of the impact of thermal cycling on the evolution of stresses in Cu through-silicon vias. J Appl Phys 115:243509
4. Okoro C, Levine LE, Xu R, Hummler K, Obeng YS (2014) Non-destructive measurement of the residual stresses in copper through-silicon vias using synchrotron-based micro-beam X-ray diffraction. IEEE Trans Electron Devices 61:2473–2479
5. Levine LE, Okoro C, Xu R (in preparation) Full elastic strain and stress tensor measurements from individual dislocation cells in copper through-Si vias
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