Investigation of Electrical Discharge Machining Efficiency with Cryogenic Copper Electrodes for AISI D2 Steel: Enhancing Material Removal Rate, Reducing Electrode Wear Rate, and Minimizing Machining Time-Reference-Cited by-同舟云学术

Investigation of Electrical Discharge Machining Efficiency with Cryogenic Copper Electrodes for AISI D2 Steel: Enhancing Material Removal Rate, Reducing Electrode Wear Rate, and Minimizing Machining Time

Published:2024-08-16 Issue: Volume: Page:
ISSN:1059-9495
Container-title:Journal of Materials Engineering and Performance
language:en
Short-container-title:J. of Materi Eng and Perform

Author:

Selvarajan L.^ORCID,Elango T.,Kannan P. R.,Perumal K. P. Srinivasa,Arun C.,Sadhishkumar S.,Kannan S.,Muthusamy P.,Sakthivel G.

Publisher

Springer Science and Business Media LLC

Link

https://link.springer.com/content/pdf/10.1007/s11665-024-09902-9.pdf

Reference39 articles.

1. L. Selvarajan, K. Venkataramanan, K.P. Srinivasa Perumal, M. Yunus, R. Alfattani, and A. Aravindhan, A Review of Spark Erosion Machining Efficiency, Characterization and Optimization Techniques for Ceramic Composites, Compos. Interfaces, 2023, 31, p 485–536.

2. R. Alfattani, M. Yunus, L. Selvarajan, and K. Venkataramanan, Spark Erosion Behavior in the Machining of MoSi2-SiC Ceramic Composites for Improving Dimensional Accuracy, J. Mech. Behav. Biomed. Mater., 2023, 148, p 106166–106166.

3. L. Selvarajan, R. Rajavel, M. Yunus, and R. Alfattani, Die-Sinking and Rotary EDM Surface and Subsurface Analysis of MoSi2-SiC Ceramic Composites, Mater. Sci. Technol., 2023, 39, p 3150–3166.

4. L. Selvarajan, K. Venkataramanan, A. Nair, and B. Choudhury, Si3N4-TiN Rotary EDM Optimization by Mo-Jaya Algorithm with Pareto Optimal Solution, Analysis of Micro-Structural and Geometrical Tolerances, J. Mech. Behav. Biomed. Mater., 2023, 145, p 105995–105995.

5. L. Selvarajan, K. Venkataramanan, B. Choudhury, and M. Chandrasekaran, Evaluating of Surface Morphology on EDD Machining Parameters for Si3N4-TiN Using TLBO-MRA, Mater. Manuf. Process., 2023, 39, p 465–479.