A review on thermally conductive polymeric composites: classification, measurement, model and equations, mechanism and fabrication methods-Reference-Cited by-同舟云学术

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A review on thermally conductive polymeric composites: classification, measurement, model and equations, mechanism and fabrication methods

Published:2018-04-18 Issue:2 Volume:1 Page:207-230
ISSN:2522-0128
Container-title:Advanced Composites and Hybrid Materials
language:en
Short-container-title:Adv Compos Hybrid Mater

Author:

Yang Xutong,Liang Chaobo,Ma Tengbo,Guo Yongqiang,Kong Jie,Gu Junwei^ORCID,Chen Minjiao,Zhu Jiahua

Funder

National Science Foundation

National Natural Science Foundation of China

Open Fund from State Key Laboratory of Solid Lubrication of Lanzhou Institute of Chemical Physics

Fundamental Research Funds for the Central Universities

The State Key Laboratory of Solidification Processing in NPU

American Chemical Society Petroleum Research Fund

Publisher

Springer Science and Business Media LLC

Link

http://link.springer.com/article/10.1007/s42114-018-0031-8/fulltext.html

Reference180 articles.

1. Robert RL (2018) Applications of high temperature polymers. CSC Press, Tysons Corner

2. Deng H, Lin L, Ji MZ, Zhang SM, Yang MB, Fu Q (2014) Progress on the morphological control of conductive network in conductive polymeric composites and the use as electroactive multifunctional materials. Prog Polym Sci 39:627–655

3. Gu JW, Guo YQ, Lv ZY, Geng WC, Zhang QY (2015) Highly thermally conductive POSS-g-SiCp/UHMWPE composites with excellent dielectric properties and thermal stabilities. Compos Part A-Appl S 78:95–101

4. Chen L, Hou X, Song N, Shi L, Ding P (2018) Cellulose/graphene bioplastic for thermal management: enhanced isotropic thermally conductive property by three-dimensional interconnected graphene aerogel. Compos Part A-Appl S 107(1):189–196

5. Li XH, Shao LB, Song N, Ding P (2016) Enhanced thermal-conductive and anti-dripping properties of polyamide composites by 3D graphene structures at low filler content. Compos Part A-Appl S 88:305–314

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