Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Mechanical Engineering
Reference15 articles.
1. Lee, H., Park, Y., Lee, S., and Jeong, H., “Preliminary Study on the Effect of Spray Slurry Nozzle in CMP for Environmental Sustainability,” Int. J. Precis. Eng. Manuf., Vol. 15, No. 6, pp. 995–1000, 2014.
2. Lee, C., Lee, H., Jeong, M., and Jeong, H., “A Study on the Correlation between Pad Property and Material Removal Rate in CMP,” Int. J. Precis. Eng. Manuf., Vol. 12, No. 5, pp. 917–920, 2011.
3. Lee, H., Jeong, H., and Dornfeld, D., “Semi-Empirical Material Rate Distribution Model for SiO2 Chemical Mechanical Polishing (CMP) Processes,” Precision Engineering, Vol. 37, No. 2, pp. 483–490, 2013.
4. Cook, L. M., “Chemical Processes in Glass Polishing,” Journal of Non-Crystalline Solids, Vol. 120, No. 1, pp. 152–171, 1990.
5. Tomozawa, M., “Oxide CMP Mechanisms,” Solid State Technology, Vol. 40, No. 7, pp. 169–175, 1997.
Cited by
38 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献