Metal and dielectric contact heat transfer and enhancement study using finite element approach
Author:
Publisher
Springer Science and Business Media LLC
Subject
Fluid Flow and Transfer Processes,Condensed Matter Physics
Link
https://link.springer.com/content/pdf/10.1007/s00231-020-02910-0.pdf
Reference39 articles.
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2. Donovan BF, Szwejkowski CJ, Duda JC, Cheaito R, Gaskins JT, Peter Yang CY, Constantin C, Jones RE, Hopkins PE (2014) Thermal boundary conductance across metal-gallium nitride interfaces from 80 to 450 K. Appl Phys Lett 105(20):203502. https://doi.org/10.1063/1.4902233
3. Andresen M, Ma K, Buticchi G, Falck J, Blaabjerg F, Liserre M (2018) Junction temperature control for more reliable power electronics. IEEE Trans Power Electron 33(1):765–776. https://doi.org/10.1109/TPEL.2017.2665697
4. Wang A, Zhao J (2010) Review of prediction for thermal contact resistance. Science China Technol Sci 53(7):1798–1808. https://doi.org/10.1007/s11431-009-3190-6
5. Xian Y, Zhang P, Zhai S, Yuan P, Yang D (2018) Experimental characterization methods for thermal contact resistance: a review. Appl Therm Eng 130:1530–1548. https://doi.org/10.1016/j.applthermaleng.2017.10.163
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