Heat dissipation from silicon chips in a vertical plate, elevated pressure cold wall system

Author:

Reisman A.,Berkenblit M.,Merz C. J.,Ray A. K.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Reference5 articles.

1. Because psi is a normally used dimension and pressure gauges are scaled in this unit, psi are used throughout. Further, in defining chip power levels, W/in2 is used commonly. Power levels are given in this dimension as well as in W/cm2.

2. F. Kreith ‘Principles of Heat Transfer’, Intext Education Publishers, 257 Park Avenue S, New York, NY 10010, 1973 p. 396.

3. J. P. Holman, ‘Heat Transfer’, McGraw-Hill Book Company, New York, 4th Edition, 1976.

4. R. K. MacGregor and A. P. Emery, J. Heat Transfer,19 391 (1969).

5. L. B. Evans and N. E. Stefany, AICHE Paper No. 4, Heat Transfer Conference, Los Angeles, CA, August 1965.

Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. A high-performance thermal module for computer packaging;Journal of Electronic Materials;1987-09

2. A thermal module design for advanced packaging;Journal of Electronic Materials;1987-09

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