1. H. Kang, S.H. Rajendran, and J.P. Jung, Low melting temperature Sn-Bi solder: effect of alloying and nanoparticle addition on the microstructural, thermal, interfacial bonding, and mechanical characteristics. Metals 11(2), 364 (2021).
2. F. Wang, H. Chen, Y. Huang, L. Liu, and Z. Zhang, Recent progress on the development of Sn–Bi based low-temperature Pb-free solders. J. Mater. Sci. Mater. Electron. 30(4), 3222 (2019).
3. S. Cheng, C.-M. Huang, and M. Pecht, A review of lead-free solders for electronics applications. Microelectron. Reliab. 75, 77 (2017).
4. K. Sweatman, T. Nishimura, T. Akaiwa, and P. Naraynanan. Optimizing solder alloy composition for low temperature assembly. SMTA international conference (Rosemont, IL, USA, 2019).
5. S. Mokler, R. Aspandiar, K. Byrd, O. Chen, S. Walwadkar, K.K. Tang, M. Renavikar, and S. Sane. The application of bi-based solders for low temperature reflow to reduce cost while improving SMT yields in client computing systems. SMTA international conference (Rosemont, IL, 2016).