Effect of Wet Pretreatment on Interfacial Adhesion Energy of Cu-Cu Thermocompression Bond for 3D IC Packages-Reference-Cited by-同舟云学术

Effect of Wet Pretreatment on Interfacial Adhesion Energy of Cu-Cu Thermocompression Bond for 3D IC Packages

Published:2009-09-10 Issue:12 Volume:38 Page:2449-2454
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Jang Eun-Jung,Hyun Seungmin,Lee Hak-Joo,Park Young-Bae

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-009-0942-9.pdf

Reference17 articles.

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3. J.-Q. Lu, Y. Kwon, R.P. Kraft, R.J. Gutman, J.F. McDonald, and T.S. Cale, Proceedings of the IEEE International Interconnect Technology Conference (2001), p. 219.

4. J.C. Koob, D.A. Leder, R.J. Sung, T.L. Brandon, D.G. Elliott, B.F. Cockburn, and L. McIlrath, IEEE Trans. VLSI Syst. 13, 358 (2005).

5. H. Tilmans, D. Van de Peer, and E. Beyne, J. Microelectromech. Syst. 9, 206 (2000).

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