1. Amagai, M.: Chip scale package (CSP) solder joint reliability and modeling. Microelectron. Reliab. 39(4), 463–477 (1999)
2. Anand, L.: Constitutive equations for hot working of metals. Int. J. Plast. 1, 213–231 (1985)
3. Auersperg, J., Schubert, A., Vogel, D., Michel, B., Reichl, H.: Fracture and damage evaluation in chip scale packages and flip chip assemblies by FEA and Microdac. Symposium on Applications of Fracture Mechanics in Electronic Packaging, Dallas, AMD-vol 222/EEP-vol 20, pp. 133–138. ASME (ASM) (1997)
4. Cho, S.-M., Han, B., Joo, J.: Temperature dependent deformation analysis of ceramic ball grid array package assembly under accelerated thermal cycling condition. J. Electron. Packag. 126, 41–47 (2004)
5. Dudek, R., Nylen, M., Schubert, A., Michel, B., Reichl, H.: An efficient approach to predict solder fatigue life and its application to SM and area array components. In: Proceedings of Electronic Components and Technology Conference, pp. 462–471 (1997)