Silica/Epoxy Hybrid Encapsulation with High Heat-Resistance and Low Coefficient of Thermal Expansion-Reference-Cited by-同舟云学术

Silica/Epoxy Hybrid Encapsulation with High Heat-Resistance and Low Coefficient of Thermal Expansion

Published:2020-07-23 Issue:11 Volume:28 Page:1040-1045
ISSN:1598-5032
Container-title:Macromolecular Research
language:en
Short-container-title:Macromol. Res.

Author:

Lee Sung Bum,Lee Ho Sik,Son Chang Bum,Kim Sung Hee,Lee Jun Young

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Polymers and Plastics,Organic Chemistry,General Chemical Engineering

Link

https://link.springer.com/content/pdf/10.1007/s13233-020-8135-8.pdf

Reference26 articles.

1. Z. Chen, Proc. of the 5th International Conference on Environment, Materials, Chemistry and Power Electronics, Zhengzhou, 2016, p 21.

2. D. H. Schramm, J. of Renewable Energy and Sustainable Development, 1, 233 (2015).

3. H. Casier, Proceesings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 7 (2004).

4. W. Hollstein, Proc. Inductica (2012).

5. L. Gang, J. Experiment Science & Technology, 8, 20 (2010).

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