Investigation of process parameters in electroless copper plating on polystyrene

Author:

Dev AtulORCID,Tandon Smriti,Jha Pankaj,Singh Prithipal,Dutt Anup

Publisher

Springer Science and Business Media LLC

Subject

Multidisciplinary

Reference20 articles.

1. Properties of Rexolite Polystyrene, http://www.uplandfab.com/rexolite, accessed on 18 June 2018

2. Bozzini B and BoniardiM 1997. Fracture Toughness of Supported Ni-P Films Prepared by Autocatalytic Chemical Deposition, Zeitschrift Fuer Metallkunde 88(6): 493–497. Retrieved from http://inis.iaea.org

3. Kang H-B, Bae J-H, Lee J-W, Park M-H, Lee Y-C, Yoon J-W, Jung S-B and Yang C-W 2009. Control of Interfacial layers Formed in Sn-3.5Ag-0.7 Cu/Electroless Ni-P Solder Joints, Scripta Materialia 60: 257-260. https://doi.org/10.1016/j.scriptamat.2008.10.017

4. Nigam S; Patel SK and Mahapatra SS 2015. Copper plating on ABS plastic by thermal spray, International Journal of Mechanical and Production Engineering (IJMPE) 3(6): 115–119

5. Cobley AJ, Abbas B and Hussain A 2014. Improved Electroless Copper Coverage at Low Catalyst Concentrations and reduced Plating Temperatures enabled by Low-Frequency Ultrasound. International Journal of Electrochemical Science 9: 7795-7804. Retrieved from http://www.electrochemsci.org

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