A microstructural study of dislocation substructures formed in metal foil substrates during ultrasonic wire bonding-Reference-Cited by-同舟云学术

A microstructural study of dislocation substructures formed in metal foil substrates during ultrasonic wire bonding

Published:1997-12 Issue:12 Volume:28 Page:2663-2671
ISSN:1073-5623
Container-title:Metallurgical and Materials Transactions A
language:en
Short-container-title:Metall and Mat Trans A

Author:

Murdeshwar Nikhil,Krzanowski James E.

Publisher

Springer Science and Business Media LLC

Subject

Metals and Alloys,Mechanics of Materials,Condensed Matter Physics

Link

http://link.springer.com/content/pdf/10.1007/s11661-997-0023-8.pdf

Reference19 articles.

1. G.G. Harman: Reliability and Yield Problems of Wire Bonding in Microelectronics, Technical Monograph, International Society for Hybrid Microelectronics, Reston, VA, 1989.

2. H.K. Charles: in Electronic Materials Handbook, vol. 1, Packaging, ASM INTERNATIONAL, Materials Park, OH, 1989, pp. 226–27.

3. J.E. Krzanowski and N. Murdeshwar: J. Electronic Mater., 1990, vol. 19, pp. 919–28.

4. K.C. Joshi: Weld. J., 1971, vol. 50, pp. 840–48.

5. G.G. Harman and K.O. Leedy: 10th Ann. Proc. Reliability Physics Symp., 1972, pp. 49–56.

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