Modeling of contact behavior between polishing pad and workpiece surface-Reference-Cited by-同舟云学术

Modeling of contact behavior between polishing pad and workpiece surface

Published:2007-11-27 Issue:1 Volume:2 Page:9-14
ISSN:0944-6524
Container-title:Production Engineering
language:en
Short-container-title:Prod. Eng. Res. Devel.

Author:

Klocke Fritz,Dambon Olaf,Zunke Richard

Publisher

Springer Science and Business Media LLC

Subject

Industrial and Manufacturing Engineering,Mechanical Engineering

Link

http://link.springer.com/content/pdf/10.1007/s11740-007-0059-z.pdf

Reference10 articles.

1. Klocke F, Hambücker S, Dambon O (2002) Influences exerted by the pad material and polishing suspension on reproducibility of a polishing process. Prod Eng IX/2:51–54

2. Archard JF (1953) The temperature of rubbing surfaces. J Appl Phys 24:981–988

3. Greenwood JA, Tripp JH (1967) The elastic contact of rough spheres. ASME J Appl Mech 34:153

4. Greenwood JA, Williamson JBP (1966) The contact of nominally flat surfaces. Proc Roy Soc Lond A 295:300

5. Qin K, Moudgil B, Park C (2004) A chemical mechanical polishing model incorporating both the chemical and mechanical effects. Thin Solid Films 446:277–286

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