Author:
Pequegnat A.,Hang C. J.,Mayer M.,Zhou Y.,Moon J. T.,Persic J.
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
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1. W.J. Greig, Integrated Circuit Packaging, Assembly and Interconnections (Springer Science + Business Media LLC, 2007)
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4. A. Shah, M. Mayer, Y. Zhou, S.J. Hong, J.T. Moon, Reduction of Underpad Stress in Thermosonic Copper Ball Bonding, in proceedings of the 58th Electronic Components and Technology Conference (2008), p. 2123–2130
5. Z.W. Zhong, H.M. Ho, Y.C. Tan, W.C. Tan, H.M. Goh, B.H. Toh, J. Tan, Microelectron. Eng. 84, 368–374 (2007)
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15 articles.
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