Effect of temperature and substrate surface texture on wettability and morphology of IMCs between Sn–0.7Cu solder alloy and copper substrate-Reference-Cited by-同舟云学术

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Effect of temperature and substrate surface texture on wettability and morphology of IMCs between Sn–0.7Cu solder alloy and copper substrate

Published:2012-02-12 Issue:9 Volume:23 Page:1664-1672
ISSN:0957-4522
Container-title:Journal of Materials Science: Materials in Electronics
language:en
Short-container-title:J Mater Sci: Mater Electron

Author:

Satyanarayan ,Prabhu K. N.

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s10854-012-0644-6.pdf

Reference26 articles.

1. H.H. Manko, Solder and Soldering, 3rd edn. (McGraw-Hill, New York, 1979), pp. 1–20

2. N.C. Lee, International Symposium on Microelectronics, vol. 4339 (Boston, MA, 2000), pp. 541–550

3. J.S. Hwang, Implementing Lead-Free Electronics (McGraw-Hill, New York, 2005), pp. 1–20

4. Satyanarayan, K.N. Prabhu, Adv. Colloid Interf. Sci. 166, 87 (2011)

5. R.N. Chukka, S. Telu, N.R.M.R. Bhargava, L. Chen, J. Mater. Sci. Mater. Electron. 22(3), 281 (2010)

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4. Effect of temperature and substrate surface roughness on wetting behavior and interfacial structure between Sn–35Bi–1Ag solder and Cu substrate;Journal of Materials Science: Materials in Electronics;2020-02-12

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